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Low-loss shielded through-silicon vias filled with multi-walled carbon nanotube bundle.
Jinrong Su
Runbo Ma
Xinwei Chen
Liping Han
Rongcao Yang
Wenmei Zhang
Published in:
Microelectron. J. (2016)
Keyphrases
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high density
low cost
data sets
neural network
integrated circuit
multiscale
high speed
highly correlated
thin film
high levels