A new IC interconnection scheme and design architecture for high performance ICs at very low fabrication cost - post passivation interconnection.
M. S. LinLing ChenJ. Y. LeeH. T. LiuC. K. ChouK. H. WanH. M. ChenKevin ChouRoger HsiaoEric LinPublished in: CICC (2003)
Keyphrases
- high density
- architectural design
- integrated circuit
- low power consumption
- software architecture
- hardware design
- knowledge based systems
- distributed architecture
- case study
- design principles
- low power
- design methodology
- agent oriented
- vlsi implementation
- real time
- expert systems
- power consumption
- design tools
- design process
- management system
- neural network
- design goals