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Research on Optimal and Experimental Process Parameters for an Ultrasonic Wire Bonding System.

Wuwei FengYuzhou ShiXin ChenCuizhu WangJiang MengDi Wang
Published in: icWCSN (2022)
Keyphrases
  • wire bonding
  • closed form
  • optimal parameters
  • maximum likelihood
  • numerical simulations
  • real world
  • life cycle
  • measured data