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Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration.
Takanori Shuto
Naoya Watanabe
Akihiro Ikeda
Tanemasa Asano
Published in:
3DIC (2011)
Keyphrases
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heterogeneous databases
high speed
distributed heterogeneous
data integration
latent semantic indexing
data fusion
integrated circuit
database
real world
computer systems
convex hull
information integration
vector space model
heterogeneous data sources
motion picture