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Silicon based system in package: Improvement of passive integration process to avoid TBMS failure.

Christian GautierSophie LedainSébastien JacquelineMatthieu NongaillardVincent GeorgelKarine Danilo
Published in: Microelectron. Reliab. (2008)
Keyphrases
  • low cost
  • three dimensional
  • software package
  • data sets
  • open source
  • root cause
  • database
  • real time
  • neural network
  • genetic algorithm
  • bayesian networks
  • high speed
  • steady state
  • failure modes
  • failure prediction