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Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu lead-free solder by adding trace amount of elements Ni and Sb.
A. E. Hammad
Published in:
Microelectron. Reliab. (2018)
Keyphrases
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mechanical properties
electron microscopy
low energy
genetic algorithm
finite element model
data sets
computer vision
decision trees
similarity measure
artificial neural networks
control system
x ray
experimental data
human behavior
printed circuit boards
mechanical design