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A 283.2μW 800Mb/s/pin DLL-based data self-aligner for Through-Silicon Via (TSV) interface.

Hyun-Woo LeeSoo-Bin LimJunyoung SongJabeom KooDae-Han KwonJong-Ho KangYunsaing KimYoung-Jung ChoiKunwoo ParkByong-Tae ChungChulwoo Kim
Published in: ISSCC (2012)
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