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High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications.
Yao-Hung Huang
Yu-Cheng Hsieh
Yu-Cheng Lin
Yue-Der Chih
Eric Wang
Jonathan Chang
Ya-Chin King
Chrong Jung Lin
Published in:
VLSI Technology and Circuits (2023)
Keyphrases
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high density
low density
high power
close proximity
data center
high bandwidth
magnetic recording
embedded systems
thin film
general purpose
information retrieval
databases
web intelligence
end to end
distributed systems
database systems
case study