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Verification and Codesign of the Package and Die Power Delivery System Using Wavelets.

Imad A. FerzliEli ChiproutFarid N. Najm
Published in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2010)
Keyphrases
  • multiresolution
  • model checking
  • wavelet transform
  • signal processing
  • power consumption
  • feature extraction
  • case study
  • software package
  • hardware software
  • genetic algorithm
  • open source
  • wavelet packet