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Chip Improvements for Future IGBT Modules.

John F. DonlonEric R. MottoTetsuo TakahashiHidenori FujiiKatsumi Satoh
Published in: IAS (2008)
Keyphrases
  • long term
  • low cost
  • artificial intelligence
  • simulation software
  • real world
  • multiscale
  • building blocks
  • parallel processing
  • database
  • real time
  • high density
  • functional modules
  • single chip
  • modular design