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Dynamic thermal modelling and analysis of press-pack IGBTs both at component-level and chip-level.

Cristian BuscaRemus TeodorescuFrede BlaabjergLars HelleTusitha Abeyasekera
Published in: IECON (2013)
Keyphrases
  • high density
  • real world
  • artificial intelligence
  • signal processing
  • levels of abstraction
  • data sets
  • genetic algorithm
  • computer vision
  • data analysis
  • higher level
  • statistical analysis