A novel hybrid resampling for semiconductor wafer defect bin classification.
You-Jin ParkRong PanDouglas C. MontgomeryPublished in: Qual. Reliab. Eng. Int. (2023)
Keyphrases
- semiconductor manufacturing
- pattern recognition
- image classification
- classification accuracy
- decision trees
- pattern classification
- classification algorithm
- supervised classification
- text classification
- cross validation
- classification models
- feature extraction
- feature selection
- object classification
- automatic classification
- classification method
- dimensionality reduction
- benchmark data sets
- cost sensitive
- artificial neural networks
- document classification
- decision rules
- unsupervised learning
- feature set