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Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material.
Tzu-Hao Wang
Hsuan Lee
Chih-Ming Chen
Ming-Guan Chen
Chi-Chang Hu
Yu-Jie Chen
Ray-Hua Horng
Published in:
Microelectron. Reliab. (2016)
Keyphrases
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light emitting
thermal conductivity
light emitting diodes
infrared
light intensity
material properties
composite materials
mechanical properties
spatially varying
high resolution
white matter
synthetic and real images
heat transfer
surface temperature