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A novel stack package solution of AC-DC chip for high-power density adapters.

Jiaxing WeiJianfeng WangNing WangSiyang LiuWeifeng Sun
Published in: ASICON (2015)
Keyphrases
  • artificial neural networks
  • high power
  • high density
  • low power
  • input output
  • low cost
  • high speed
  • genetic algorithm
  • linear equations
  • multiresolution
  • power supply
  • ofdm system