Login / Signup
The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate.
R. K. Shiue
L. W. Tsay
C. L. Lin
J. L. Ou
Published in:
Microelectron. Reliab. (2003)
Keyphrases
</>
mechanical properties
empirical studies
high density
information systems
statistical analysis
theoretical framework