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The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate.

R. K. ShiueL. W. TsayC. L. LinJ. L. Ou
Published in: Microelectron. Reliab. (2003)
Keyphrases
  • mechanical properties
  • empirical studies
  • high density
  • information systems
  • statistical analysis
  • theoretical framework