On-chip testing of blind and open-sleeve TSVs for 3D IC before bonding.

Po-Yuan Chen Cheng-Wen Wu Ding-Ming Kwai

Published in: VTS (2010)

Keyphrases

high speed
low cost
integrated circuit
vlsi implementation
search engine
case study
high density
database
neural network
genetic algorithm
low power
physical design
motion deblurring
programmable logic
solid models