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Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contamination.

Lois Jinzhi LiaoXi ZhangXiaomin LiYounan HuaChao FuWeikok TeeBoonhwa YeeBisheng WangSonglin Mao
Published in: ICICDT (2019)
Keyphrases
  • bond pad
  • wire bonding
  • stress response
  • real world
  • bayesian networks
  • finite element model
  • genetic algorithm
  • image processing
  • optimal solution