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An 890 mW stacked power amplifier using SiGe HBTs for X-band multifunctional chips.
Chao Liu
Qiang Li
Yihu Li
Xiang Li
Haitao Liu
Yong-Zhong Xiong
Published in:
ESSCIRC (2015)
Keyphrases
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power consumption
high power
power supply
high density
low power
high speed
thin film
integrated circuit
case study
dynamic range
chip design
neural network
power distribution
wind turbine
computational intelligence
long term
artificial intelligence