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Enhanced CDM-robustness for the packaged IC with the extra bonding wire to the die-attach plate.
Tzu-Cheng Kao
Jian-Hsing Lee
Chen-Hsin Lien
Chih-Hsien Wang
Kuang-Cheng Tai
Hung-Der Su
Published in:
IRPS (2015)
Keyphrases
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integrated circuit
three dimensional
information systems
e learning
knowledge base
image processing
wide range
multiresolution
mobile robot
computational efficiency
machine vision
high end
high robustness
intra personal