Packaging and Assembly Challenges for 50G Silicon Photonics Interposers.
Bradley SnyderNivesh MangalGuy LepageSadhishkumar BalakrishnanXiao SunNicolas PantanoMichal RakowskiLieve BogaertsPeter De HeynPeter VerheyenAndy MillerMarianna PantouvakiPhilippe AbsilJoris Van CampenhoutPublished in: OFC (2018)