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Thermal impact of 3D stacking and die thickness: Analysis and characterization of a memory-on-logic 3D circuit.

Cristiano SantosPascal VivetRicardo Augusto da Luz Reis
Published in: ICECS (2014)
Keyphrases
  • statistical analysis
  • case study
  • data analysis
  • high speed
  • quantitative analysis
  • finite element analysis
  • logic circuits