Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies.
Tiago Maurício LeiteCláudia FreitasRoberto MagalhaesAlexandre Ferreira da SilvaJosé R. AlvesJúlio C. VianaIsabel DelgadoPublished in: Sensors (2023)