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Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies.

Tiago Maurício LeiteCláudia FreitasRoberto MagalhaesAlexandre Ferreira da SilvaJosé R. AlvesJúlio C. VianaIsabel Delgado
Published in: Sensors (2023)
Keyphrases
  • optical fiber
  • printed circuit boards
  • high sensitivity
  • surface temperature
  • integrated circuit
  • visual inspection
  • pattern recognition
  • image analysis