A novel dimensional analysis method for TSV modeling and analysis in three dimensional integrated circuits.
Khaled SalahYehea I. IsmailPublished in: ISCAS (2014)
Keyphrases
- three dimensional
- integrated circuit
- objective function
- probabilistic model
- significant improvement
- high precision
- statistical analysis
- high accuracy
- image analysis
- prior knowledge
- data sets
- cost function
- computational cost
- computational complexity
- edge detection
- multi dimensional
- bayesian networks
- image processing
- learning algorithm