A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC.
Dongki KimSungjoo YooSunggu LeeJung Ho AhnHyunuk JungPublished in: DATE (2011)
Keyphrases
- quantitative analysis
- embedded systems
- qualitative analysis
- mobile devices
- mobile phone
- qualitative evaluation
- qualitative and quantitative analysis
- mobile learning
- low power
- mobile applications
- context aware
- computing environments
- m learning
- mobile users
- hardware and software
- mobile computing
- combining multiple
- mobile environments
- location aware
- x ray