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Reliability assessment of multi-via Cu-damascene structures by wafer-level isothermal electromigration tests.

Alessandro MarrasMaurizio ImprontaIlaria De MunariM. G. ValentiniAndrea Scorzoni
Published in: Microelectron. Reliab. (2007)
Keyphrases
  • integrated circuit
  • reliability assessment
  • databases
  • bp neural network model
  • software defect
  • real world
  • machine learning
  • artificial intelligence
  • decision making
  • artificial neural networks