Sign in
Reliability assessment of multi-via Cu-damascene structures by wafer-level isothermal electromigration tests.
Alessandro Marras
Maurizio Impronta
Ilaria De Munari
M. G. Valentini
Andrea Scorzoni
Published in:
Microelectron. Reliab. (2007)
Keyphrases
</>
integrated circuit
reliability assessment
databases
bp neural network model
software defect
real world
machine learning
artificial intelligence
decision making
artificial neural networks