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Fast Scan-Chain Ordering for 3-D-IC Designs Under Through-Silicon-Via (TSV) Constraints.
Christina C.-H. Liao
Allen W.-T. Chen
Louis Y.-Z. Lin
Charles H.-P. Wen
Published in:
IEEE Trans. Very Large Scale Integr. Syst. (2013)
Keyphrases
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ordering constraints
databases
low cost
real time
learning algorithm
search algorithm
information systems
video sequences
constraint satisfaction
constraint programming
integrated circuit
global constraints
partial ordering
ordering heuristics