Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology.
Hiroyuki ItoHideyuki SugitaKenichi OkadaTatsuya ItoKazuhisa ItoiMasakazu SatoRyozo YamauchiKazuya MasuPublished in: IEICE Trans. Electron. (2007)
Keyphrases
- low power consumption
- consumer electronics
- distributed systems
- cost effective
- high speed
- computer systems
- computing environments
- personal computer
- peer to peer
- distributed environment
- scale space
- integrated circuit
- cooperative
- multi agent
- heterogeneous systems
- electronic devices
- high end
- power consumption
- low cost
- mobile devices
- wearable devices
- cmos technology
- computer networks
- desktop computers
- communication technologies
- low power
- case study
- multiscale