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Wafer-level electromigration for reliability monitoring: Quick-turn electromigration stress with correlation to package-level stress.

D. SlottkeR. J. KamaladasaM. HarmesIlan TsameretM. KobrinskyTimothy McMullenJohn Dunklee
Published in: IRPS (2015)
Keyphrases
  • levels of abstraction
  • neural network
  • wide range
  • higher level
  • real time
  • data sets
  • computer vision
  • decision making
  • image processing
  • search algorithm
  • power law