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Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics.

Muhammad AamirRiaz MuhammadNaseer AhmedMuhammad Waqas
Published in: Microelectron. Reliab. (2017)
Keyphrases
  • mechanical properties
  • composite materials
  • finite element model
  • high temperature
  • finite element analysis
  • stainless steel
  • finite element