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A hybrid intelligent approach for optimizing the fine-pitch copper wire bonding process with multiple quality characteristics in IC assembly.

Tsung-Nan Tsai
Published in: J. Intell. Manuf. (2014)
Keyphrases
  • wire bonding
  • hybrid intelligent
  • high quality
  • neural network
  • process model
  • quality measures
  • integrated circuit
  • higher quality
  • process planning
  • printed circuit boards
  • improve quality
  • bond pad