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Fabrication of silicon-based MEMS capacitive microphone structure with thin starting wafer.

Xiaoxu KangChao YuanQingyun ZuoChangwa YaoShoumian ChenYuhang ZhaoYilin YanYuanjun XuWeiping Zhou
Published in: ASICON (2013)
Keyphrases
  • integrated circuit
  • high density
  • high speed
  • structural properties
  • neural network
  • multiscale
  • structural information
  • databases
  • data mining
  • information systems
  • low cost
  • complex structures