Yield analysis of a novel wafer manipulation method in 3D stacking.
Bei ZhangBaohu LiVishwani D. AgrawalPublished in: 3DIC (2013)
Keyphrases
- detection method
- high accuracy
- experimental evaluation
- high precision
- synthetic data
- multiscale
- preprocessing
- theoretical analysis
- data sets
- support vector machine
- training samples
- model selection
- computational cost
- cost function
- significant improvement
- prior knowledge
- pairwise
- dynamic programming
- mutual information
- computationally efficient
- optimization algorithm
- learning algorithm
- segmentation method
- machine learning