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3D-LIN: A configurable low-latency interconnect for multi-core clusters with 3D stacked L1 memory.
Giulia Beanato
Igor Loi
Giovanni De Micheli
Yusuf Leblebici
Luca Benini
Published in:
VLSI-SoC (2012)
Keyphrases
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low latency
high speed
high bandwidth
real time
highly efficient
high throughput
stream processing
virtual machine
massive scale
continuous query processing
data structure
data acquisition
data mining
data points
data distribution
mobile nodes