Prediction of Wafer Map Categories Using Wafer Acceptance Test Parameters in Semiconductor Manufacturing.
Martin Ying Song LimAnurag SharmaCheng Siong ChinChun Ming Tommy YipJonathan Yoong Seang OngPublished in: AIAI (2) (2022)
Keyphrases
- semiconductor manufacturing
- discrete event simulation
- process control
- prediction accuracy
- root mean square error
- maximum likelihood
- linear regression model
- test data
- maximum a posteriori
- sensitivity analysis
- neural network
- parameter settings
- maximum a posteriori probability
- prediction algorithm
- massively parallel
- statistical significance
- parameter space
- parameter estimation
- expectation maximization
- expert systems