Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs.
Tadanori ShimotoKazuhiro BabaKoji MatsuiJun TsukanoTakehiko MaedaKenji OyachiPublished in: Microelectron. Reliab. (2005)
Keyphrases
- high density
- magnetic recording
- low density
- constraint satisfaction problems
- latent semantic indexing
- close proximity
- high power
- constraint satisfaction
- thin film
- data center
- high bandwidth
- arc consistency
- constraint propagation
- text retrieval
- high speed
- solving constraint satisfaction problems
- backtracking algorithm
- databases
- symmetry breaking
- constraint networks
- multi layer
- cost effective