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ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design.

Hyunsu ChaeKeren ZhuBhyrav MutnuryDouglas WallaceDouglas WinterbergDaniel De AraujoJay ReddyAdam R. KlivansDavid Z. Pan
Published in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2024)
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