Modeling and compare of through-silicon-via (TSV) in high frequency.
Ran WangGary CharlesPaul D. FranzonPublished in: 3DIC (2011)
Keyphrases
- high frequency
- low frequency
- visual quality
- subband
- high resolution
- wavelet transform
- high frequencies
- low pass
- discrete wavelet transform
- high frequency components
- low cost
- wavelet domain
- frequency band
- wavelet coefficients
- blocking artifacts
- image compression
- image data
- wavelet decomposition
- high quality
- machine learning