High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices.
Shigeru KanazawaHiroshi YamazakiYuta UedaWataru KobayashiYoshihiro OgisoJohsuke OzakiTakahiko ShindoSatoshi TsunashimaHiromasa TanobeAtsushi AraratakePublished in: IEICE Trans. Electron. (2019)