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A convenient wafer level bonding based on unpatterned BCB.

Lei LiKangfa DengWen XiaNingli ZhuSong LiWeiguo SuWei Zhang
Published in: NEMS (2014)
Keyphrases
  • databases
  • cooperative
  • special case
  • integrated circuit
  • database
  • data sets
  • neural network
  • high level
  • pairwise
  • artificial neural networks
  • color images
  • supply chain
  • fine grained