The bond Strength Measurement of silicon-silicon bonding wafers Based on Crack Opening Method.

Liguo Chen Tao Chen Lining Sun

Published in: Int. J. Inf. Acquis. (2006)

Keyphrases

high precision
experimental evaluation
computationally efficient
cost function
detection method
pairwise
dynamic programming
high accuracy
theoretical analysis
segmentation method
neural network
computational complexity
significant improvement
fully automatic