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Stacking memory architecture exploration for three-dimensional integrated circuit in 3-D PAC.
Hsien-Ching Hsieh
Po-Han Huang
Chi-Hung Lin
Huang-Lun Lin
Published in:
SoCC (2012)
Keyphrases
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integrated circuit
three dimensional
memory management
management system
upper bound
image sequences
x ray
image processing
sample complexity
memory requirements
software engineering
real time
hardware implementation
combining multiple
d objects
pac learning
memory access