3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers.
Masahide GotoYuki HondaMasakazu NanbaYoshinori IguchiTakuya SarayaMasaharu KobayashiEiji HigurashiHiroshi ToshiyoshiToshiro HiramotoPublished in: Imaging Sensors and Systems (2022)
Keyphrases
- image sensor
- dynamic range
- video camera
- low power
- imaging systems
- digital camera
- image processing algorithms
- single chip
- hardware and software
- motion blur
- solid state
- parallel processing
- integrated circuit
- power consumption
- analog to digital converter
- cmos technology
- liquid crystal
- image processing
- spatially varying
- low cost
- image analysis
- image sequences
- noisy images