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Single-Event Upset Responses of Dual- and Triple-Well D Flip-Flop Designs in 7-nm Bulk FinFET Technology.

L. XuJ. CaoBharat L. BhuvaIndranil ChatterjeeS.-J. WenR. WongLloyd W. Massengill
Published in: IRPS (2019)
Keyphrases
  • flip flops
  • cmos technology
  • nm technology
  • silicon on insulator
  • case study
  • computer systems
  • event detection
  • computer vision
  • pattern recognition
  • low power
  • image formation
  • power dissipation