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Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies.
Nauman H. Khan
Syed M. Alam
Soha Hassoun
Published in:
IEEE Trans. Very Large Scale Integr. Syst. (2011)
Keyphrases
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human factors
case study
design principles
engineering design
data mining
human computer interaction
power consumption
software engineering
high speed
knowledge based systems
building blocks
power system
design decisions
current status
power management
chip design