A hybrid optimization approach for chip placement of multi-chip module packaging.
Ping YangXiangnan QinPublished in: Microelectron. J. (2009)
Keyphrases
- high density
- high speed
- low cost
- host computer
- vlsi implementation
- analog vlsi
- single chip
- solid models
- optimization problems
- chip design
- vlsi design
- constrained optimization
- optimization process
- global optimization
- optimization method
- information systems
- neural network
- physical design
- modular design
- energy consumption
- case study