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UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper.

Mohammad Al KtashMona StefanakisTim EnglertMaryam S. L. DrechselJan StiedlSimon GreenTimo JacobBarbara BoldriniEdwin OstertagKarsten RebnerMarc Brecht
Published in: Sensors (2021)
Keyphrases
  • hyperspectral imaging
  • multiscale
  • thin film
  • wire bonding
  • image analysis
  • computational cost
  • infrared
  • kalman filter
  • target detection
  • hyperspectral data