A Novel Packaging Stress Isolation Chip for MEMS Devices.

Bowen Xing Bin Zhou Jin Wang Bo Hou Xiang Li Qi Wei Rong Zhang

Published in: IEEE SENSORS (2019)

Keyphrases

high density
high speed
mobile devices
low cost
embedded devices
design process
programmable logic
low power consumption
analog vlsi
neural network
personal computer
stress response