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Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages.
Liang Zhang
Song-bai Xue
Li-li Gao
Zhong Sheng
Sheng-lin Yu
Yan Chen
Wei Dai
Feng Ji
Zeng Guang
Published in:
Microelectron. Reliab. (2010)
Keyphrases
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neural network
electron microscopy
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computer vision
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experimental study
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