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Creep behaviour of Sn-3.8Ag-0.7Cu under the effect of electromigration: Experiments and modelling.

Fei SuRonghai MaoXiaoyan WangGuangzhou WangHaiyan Pan
Published in: Microelectron. Reliab. (2011)
Keyphrases
  • electron microscopy
  • data sets
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  • neural network
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  • three dimensional
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  • x ray
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  • negative impact