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A Novel Low Loss 3D System-in-Package Approach for 60GHz Antenna on Chip Applications.

Stephen AdamshickSandhiya Reddy GovindarajuluElias A. Alwan
Published in: MWSCAS (2020)
Keyphrases
  • high speed
  • dual band
  • low cost
  • frequency band
  • resonant frequency
  • low power
  • software package
  • low power consumption
  • analog vlsi
  • antenna array
  • high density
  • single chip
  • programmable logic
  • deep space